LogicFolding
7 June 2026
Since 2019, US export controls have blocked Huawei
from accessing the world's most advanced chip-making equipment.
Despite this, Huawei just announced a 53% jump in chip density
using a novel chip design approach called LogicFolding.
0:00 How Huawei Broke Two Rules at Once
1:39 The Power of Moore's Law
3:00 The Problem with Small Things
5:21 How Huawei's LogicFolding Works
7:49 Kirin 2026 Chip Performance Numbers
12:12 The Unsolved Problems
13:35 How Do You Solve a Problem Like Moore's Law
Extreme Ultraviolet (EUV) lithography lab in Shenzhen,
YouTube,
Dr Ben Miles